Product Summary
The W83697HF is a winbond. It features a whole new interface, namely LPC (Low Pin Count) interface, which will be supported in the new generation chip-set. This interface as its name suggests is to provide an economical implementation of I/Os interface with lower pin count and still maintains equivalent performance as its ISA interface counterpart. Approximately 40 pin counts are saved in LPC I/O comparing to ISA implementation. With this additional freedom, we can implement more devices on a single chip as demonstrated in W83697HFs integration of Game Port and MIDI Port. It is fully transparent in terms of software which means no BIOS or device driver update is needed except chip-specific configuration.
Parametrics
W83697HF absolute maximum ratings: (1)power supply voltage: -0.5 to 7V; (2)input voltage: -0.5 to VDD+0.5V; (3)RTC battery voltage: 2.2 to 4V; (4)operating temperature: 0 to 70℃; (5)storage temperature: -55 to 150℃.
Features
W83697HF features: (1)Meet LPC Spec. 1.01; (2)Support LDRQ#(LPC DMA), SERIRQ (serial IRQ); (3)Include all the features of Winbond I/O W83877TF; (4)Integrate Hardware Monitor functions; (5)Compliant with Microsoft PC98/PC99 Hardware Design Guide; (6)Support DPM (Device Power Management), ACPI; (7)Programmable configuration settings; (8)Single 24 or 48 MHz clock input.
Diagrams
Image | Part No | Mfg | Description | Pricing (USD) |
Quantity | |||||||
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W83697HF |
Other |
Data Sheet |
Negotiable |
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Image | Part No | Mfg | Description | Pricing (USD) |
Quantity | |||||||
W83601G |
IC GP I/O SMBUS 20-SSOP |
Data Sheet |
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W83601R |
Other |
Data Sheet |
Negotiable |
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W83602G |
IC GP I/O SMBUS 20-SSOP |
Data Sheet |
Negotiable |
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W83602R |
Other |
Data Sheet |
Negotiable |
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W83626D |
Other |
Data Sheet |
Negotiable |
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W83626F |
Other |
Data Sheet |
Negotiable |
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