KFG1G16U2C-AIB6

highly integrated non-volatile memory, FBGA, 2.7V to 3.6V, 40mA, 66Mhz

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Price:: US $1.00~2.00 / piece [Get Latest Price]

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PartNumber:: KFG1G16U2C-AIB6

Brand:: Samsung semiconductor - SAMSUNG | Pack: FBGA | D/C: 06+

Availability:: Supply Ability: 10000/Week Can Ship Immediately
Delivery: 10-15 Business Days (ships out within 3 Business days)

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Products Upload time: 2012-01-16

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Part Number:KFG1G16U2C-AIB6
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Product Summary

The KFG1G16U2C-AIB6 is a highly integrated non-volatile memory solution based around a NAND Flash memory array. The KFG1G16U2C-AIB6 takes advantage of the higher performance NAND program time, low power, and high density and combines it with the synchronous read performance of NOR. The NOR Flash host interface makes the KFG1G16U2C-AIB6 an ideal solution for applications like G3 Smart Phones, Camera Phones, and mobile applications that have large, advanced multimedia applications and operating systems, but lack a NAND controller.

Parametrics

KFG1G16U2C-AIB6 absolute maximum ratings: (1)Voltage on any pin relative to VSS: Vcc: -0.5V to + 4.6V, VIN: -0.5V to + 4.6V; (2)Temperature Under Bias Industrial: -40℃ to +125℃; (3)Storage Temperature: -65℃ to +150℃; (4)Short Circuit Output Current: 5mA; (5)Recommended Operating Temperature: -40℃ to +85℃

Features

KFG1G16U2C-AIB6 features: (1)Design Technology: C die ; (2)Supply Voltage: 3.3V (2.7V to 3.6V) ; (3)Host Interface: 16 bit; (4)5KB Internal BufferRAM: 1KB BootRAM, 4KB DataRAM; (5)SLC NAND Array: (2K+64)B Page Size, (128K+4K)B Block Size; (6)Multiple Sector Read/Write: Up to 4 sectors using Sector Count Register; (7)Multiple Reset Modes: Cold/Warm/Hot/NAND Flash Core Reset; (8)Multi Block Erase:up to 64 Blocks; (9)Standby current: 35uA; (10)Synchronous Burst Read current(66Mhz): 40mA; (11)Load current: 40mA; (12)Program current: 35mA; (13)Erase current: 30mA; (14)Multi Block Erase current: 30mA; (15)Voltage detector generating internal reset signal from Vcc; (16)Hardware reset input (RP); (17)Data Protection Modes; (18)User-controlled One Time Programmable(OTP) area; (19)Internal 2bit EDC / 1bit ECC; (20)Internal Bootloader supports Booting Solution in system; (21)Handshaking Feature; (22)Detailed chip information.